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HIP2123FRTBZ123
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HIP2123FRTBZ
  • Manufacturer No:
    HIP2123FRTBZ
  • Manufacturer:
    Intersil (Renesas Electronics America)
  • Category:
    PMIC - Gate Drivers
  • Datasheet:
    HIP2123FRTBZ
  • SKU:
    11058734
  • Description:
    RoHS Compliant Active MATTE TIN e3 IC Gate Driver 4mm 14V 3.1W 2A

HIP2123FRTBZ Details

RoHS Compliant Active MATTE TIN e3 IC Gate Driver 4mm 14V 3.1W 2A

HIP2123FRTBZ Specification Parameters

  • Part Status: Active
  • Mount: Surface Mount
  • RoHS Status: RoHS Compliant
  • High Side Driver: YES
  • Max Operating Temperature: 125°C
  • Supply Voltage: 12V
  • Pin Count: 9
  • Published: 2010
  • Current - Output: 2A
  • Width: 4mm
  • Terminal Pitch: 0.8mm
  • Min Supply Voltage: 8V
  • Max Supply Voltage: 14V
  • Max Supply Current: 4mA
  • Height Seated (Max): 0.75mm
  • Interface IC Type: HALF BRIDGE BASED MOSFET DRIVER
  • Turn Off Time: 60 μs
  • Rise Time: 600ns
  • Number of Drivers: 2
  • Number of Functions: 1
  • Radiation Hardening: No
  • JESD-609 Code: e3
  • Min Operating Temperature: -40°C
  • Number of Terminations: 9
  • Number of Pins: 9
  • Terminal Position: QUAD
  • Output Peak Current Limit-Nom: 2A
  • Length: 4mm
  • Terminal Finish: MATTE TIN
  • Temperature Grade: AUTOMOTIVE
  • Nominal Supply Current: 4mA
  • Subcategory: MOSFET Drivers
  • Fall Time (Typ): 600 ns
  • Power Dissipation-Max: 3.1W
  • Turn On Time: 60 μs

Intersil (Renesas Electronics America) — Manufacturer Introduction

Intersil (Renesas Electronics America)
Effective January 1, 2018, Renesas and Intersil will operate as one unified enterprise, bringing about a significant expansion to the intrinsic capabilities of semiconductors. This combination unites the widely acclaimed Renesas MCU and SoC technologies with Intersil’s market-leading expertise in high performance power management and precision analog devices. In turn, this brings organic growth in the automotive, industrial and broad-based sectors, allowing the new enterprise to respond with greater speed to customers’ systems needs. The union of Renesas with Intersil began with the completion of the acquisition on February 24, 2017, and the unified “One Global Renesas” went into operation across all markets the following July — bringing together the strengths of both organizations in anticipation of customer requirements in a rapidly changing market environment. This truly global organization offers a vast synergistic effect. Join Renesas as it strengthens its leading position in the global semiconductor market.

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